SINOPACK.SINOPACK, as a leading enterprise in China's electronic ceramics industry, holds a top market share domestically and is committed to becoming a world-class supplier of electronic ceramic products. Its technological strengths in electronic ceramics primarily manifest in new electronic ceramic materials, semiconductor package simulation design, and manufacturing processes. In design, the company possesses advanced design methodologies and software platforms capable of optimizing ceramic packages for structure, routing, electrical performance, thermal management, and reliability. The company has achieved the capability to design and develop 1.6Tbps optical communication device housings and substrates, matching the technical standards of comparable international products. It possesses thermodynamic reliability simulation capabilities for ceramic materials like alumina and aluminum nitride combined with novel metal bonding techniques, meeting the thermal dissipation and reliability requirements for next-generation wireless power device housings. In process technology, the company possesses a complete set of multilayer ceramic package manufacturing techniques, including raw material preparation, casting, punching and cavity forming, metallization printing, lamination, thermal cutting, sintering, nickel plating, brazing, and gold plating. The company has established comprehensive processing platforms for alumina and aluminum nitride ceramics, including: - Alumina multilayer ceramic processes centered on casting - High-temperature thick-film metallization processes focused on thick-film printing - Brazing assembly processes utilizing high-temperature solder - Nickel and gold plating processes employing electroplating and chemical plating These form a complete precision ceramic component manufacturing platform. Primary products include: electronic ceramic housings for communication devices, electronic ceramic housings for industrial lasers, ceramic housings and substrates for consumer electronics, automotive electronic components, and precision ceramic components.
